Thermography detects surface temperature and subsurface thermal activity of an object based on the Stefan-Boltzmann law. Impacts of the technology would be more far-reaching with finer thermal sensitivity, called noise-equivalent differential temperature (NEDT). Existing efforts to advance NEDT are all focused on improving registration of radiation signals with better cameras, driving the number close to the end of the roadmap at 20 to 40 mK. In this work, we take a distinct approach of sensitizing surface radiation against minute temperature variation of the object. The emissivity of the thermal imaging sensitizer (TIS) rises abruptly at a preprogrammed temperature, driven by a metal-insulator transition in cooperation with photonic resonance in the structure. The NEDT is refined by over 15 times with the TIS to achieve single-digit millikelvin resolution near room temperature, empowering ambient thermography for a broad range of applications such as in operando electronics analysis and early cancer screening.

Abstract Thermal radiation from a black body increases with the fourth power of absolute temperature (T4), an effect known as the Stefan–Boltzmann law. Typical materials radiate heat at a portion of this limit, where the portion, called integrated emissivity (εint), is insensitive to temperature (|dεint/dT| ≈ 10-4 °C–1). The resultant radiance bound by the T4 law limits the ability to regulate radiative heat. Here, an unusual material platform is shown in which εint can be engineered to decrease in an arbitrary manner near room temperature (|dεint/dT| ≈ 8 × 10-3 °C–1), enabling unprecedented manipulation of infrared radiation. As an example, εint is programmed to vary with temperature as the inverse of T4, precisely counteracting the T4 dependence; hence, thermal radiance from the surface becomes temperature-independent, allowing the fabrication of flexible and power-free infrared camouflage with unique advantage in performance stability. The structure is based on thin films of tungsten-doped vanadium dioxide where the tungsten fraction is judiciously graded across a thickness less than the skin depth of electromagnetic screening.

Thermal emission from objects tends to be spectrally broadband, unpolarized, and temporally invariant. These common notions are now challenged with the emergence of new nanophotonic structures and concepts that afford on-demand, active manipulation of the thermal emission process. This opens a myriad of new applications in chemistry, health care, thermal management, imaging, sensing, and spectroscopy. Here, we theoretically propose and experimentally demonstrate a new approach to actively tailor thermal emission with a reflective, plasmonic metasurface in which the active material and reflector element are epitaxially grown, high-carrier-mobility InAs layers. Electrical gating induces changes in the charge carrier density of the active InAs layer that are translated into large changes in the optical absorption and thermal emission from metasurface. We demonstrate polarization-dependent and electrically controlled emissivity changes of 3.6%P (6.5% in relative scale) in the mid-infrared spectral range.

State-of-the-art silicon water splitting photoelectrochemical cells employ oxide protection layers that exhibit electrical conductance in between that of dielectric insulators and electronic conductors, optimizing both built-in field and conductivity. The SiO2-like layer interposed between a deposited protective oxide film and its Si substrate plays a key role as a tunnel oxide that can dominate the total device impedance. In this report, we investigate the effects of changes in interfacial SiO2 resistance and capacitance in the oxide bilayer through both solid state leakage current and capacitance–voltage measurements and through electrochemical methods applied to water splitting cells. Modelling is performed to describe both types of data in a simple and intuitive way, allowing for insights to be developed into the connections among both the dielectric (charge storage) and conductive (charge transport) properties of bilayer protective oxides and their effects on oxygen evolution performance. Finally, atomic layer deposited (ALD) Al2O3 is studied as an insulator layer with conductivity intermediate between that of tunnel oxide SiO2 and the more conductive ALD-TiO2, to further generalize this understanding.

We report on the role of hydrogen (forming gas) post-metal annealing to passivate border traps in Al2O3/In0.53Ga0.47As (100) gate stacks and of bias temperature stress treatments to generate/depassivate such traps. Experiments are carried out with Pd metal gates that efficiently dissociate molecular hydrogen during forming gas annealing, and they make use of InGaAs epitaxial layer substrates that are capped with arsenic after completion of their growth, to avoid unintentional oxide formation and disorder at the channel surface prior to atomic layer deposition of the Al2O3 gate dielectric. We find that forming gas anneal (FGA) greatly reduces both the interface trap density and border trap density measured in the gate stacks, but that the effectiveness of FGA for border trap passivation saturates for anneals with thermal budgets greater than 450°C/30 min. Both negative and positive bias temperature stress treatments are found to have no effect on the extracted border trap densities compared to non-treated capacitors.

We explore the electronic and transport properties out of a biased multilayer hexagonal boron nitride (h-BN) by first-principles calculations. The band gaps of multilayer h-BN decrease almost linearly with increasing perpendicular electric field, irrespective of the layer number N and stacking manner. The critical electric filed (E0) required to close the band gap decreases with the increasing N and can be approximated by E0 = 3.2 / (N − 1) (eV). We provide a quantum transport simulation of a dual-gated 4-layer h-BN with graphene electrodes. The transmission gap in this device can be effectively reduced by double gates, and a high on-off ratio of 3000 is obtained with relatively low voltage. This renders biased MLh-BN a promising channel in field effect transistor fabrication.