Huang Z, Yang K, He Y, Dong Z, Sun Z, TANG X, Li M, WANG R, Cheng Z. First Demonstration of Three-Dimensional Thermal Conductivity Distribution Measurements of Interconnect Stacks Down to 3 nm Process Nodes, in IEEE IEDM.; 2025.

Zou Z, Tao H, Zhang J, Wu R, Cai L, Cheng Z, Hao M. Nonmonotonic phonon thermal conductivity modulated by electron–phonon interaction in graphene/h-BN heterostructures. Applied Physics Letters. 2025;127(13).

Moriyama C, Cheng Z, Huang Z, Ohno Y, Inoue K, Nagai Y, Shigekawa N, Liang J. Direct Integration of Polycrystalline Diamond With 3C‐SiC for Enhanced Thermal Management in GaN HEMTs: Impact of Grain Structure and Interface Engineering. Advanced Materials Technologies. 2025;10(21):e00437.

Zhou H, Zhang C, Zhang K, Huang Z, Liu F, Zhou M, Gong H, Tang S, Liu W, Wang B. High power density gallium nitride radio frequency transistors via enhanced nucleation in heteroepitaxy. Nature Communications. 2025.

Huang Z, Liang J, Wang Y, Sun Z, Shigekawa N, Li M, WANG R, Cheng Z. Experimental Observation of Extremely Strong Defect-Phonon Scatterings in Semiconductor Single Crystals. Applied Physics Reviews. 2025.

Huang Z, Yang Y, Sheng D, Li H, Wang Y, Sun Z, Li M, WANG R, HUANG R, Cheng Z. Thermal Conductivity of Cubic Silicon Carbide Single Crystals Heavily Doped by Nitrogen. Journal of Applied Physics. 2025.

Xiong Y, Li S, Wang R, Cheng Z, Yang J, Li D, Liu X, Xu D. Ultralow Contact Thermal Resistance between Bismuth Selenide Nanoribbons Achieved by Current-Induced Annealing. ACS Applied Materials & Interfaces. 2024;16(42):57824-57831.

Cheng Z, Huang Z, Sun J, Wang J, Feng T, Ohnishi K, Liang J, Amano H, HUANG R. (Ultra) wide bandgap semiconductor heterostructures for electronics cooling. Applied Physics Reviews. 2024;11(4).

Ji X, Huang Z, Ohno Y, Inoue K, Nagai Y, Sakaida Y, Uratani H, Sun J, Shigekawa N, Liang J, et al. Interfacial reaction boosts thermal conductance of room‐temperature integrated semiconductor interfaces stable up to 1100° C. Advanced Electronic Materials. 2024:2400387.

Masten HN, Lundh JS, Feygelson TI, Sasaki K, Cheng Z, Spencer JA, Liao P-Y, Hite JK, Pennachio DJ, Jacobs AG. Reduced temperature in lateral (AlxGa1− x) 2O3/Ga2O3 heterojunction field effect transistor capped with nanocrystalline diamond. Applied Physics Letters. 2024;124(15).

Li R, Hussain K, Liao ME, Huynh K, Bin Hoque MS, Wyant S, Koh YR, Xu Z, Wang Y, Luccioni DP. Enhanced Thermal Boundary Conductance across GaN/SiC Interfaces with AlN Transition Layers. ACS Applied Materials & Interfaces. 2024.

Cheng Z, Huang Y-J, Zahiri B, Kwon P, Braun PV, Cahill DG. Ionic Peltier effect in Li-ion electrolytes. Physical Chemistry Chemical Physics. 2024.

Sun J, Cheng Z, Liang J, Shigekawa N, Kawamura K, Uratani H, Sakaida Y, Cahill DG. Probe beam deflection technique with liquid immersion for fast mapping of thermal conductance. Applied Physics Letters. 2024;124(4).

Hobart KD, Feygelson TI, Tadjer MJ, Anderson TJ, Koehler AD, Graham Jr S, Goorsky M, Cheng Z, Yates L, Bai T. Diamond on nanopatterned substrate. 2023.

Liao ME, Huynh K, Cheng Z, Shi J, Graham S, Goorsky MS. Thermal transport and structural improvements due to annealing of wafer bonded β-Ga2O3| 4H-SiC. Journal of Vacuum Science & Technology A. 2023;41(6).

Kagawa R, Cheng Z, Kawamura K, Ohno Y, Moriyama C, Sakaida Y, Ouchi S, Uratani H, Inoue K, Nagai Y. High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes. Small. 2023:2305574.

Lee H, Zhou Y, Jung S, Li H, Cheng Z, He J, Chen J, Sokalski P, Dolocan A, Gearba‐Dolocan R. High‐Pressure Synthesis and Thermal Conductivity of Semimetallic θ‐Tantalum Nitride. Advanced Functional Materials. 2023:2212957.

Feng T, Zhou H, Cheng Z, Larkin L, Neupane M. A Critical Review of Thermal Transport across Wide and Ultrawide Bandgap Semiconductor Interfaces. ACS Applied Materials & Interfaces [Internet]. 2023;15(25):29655–29673. 访问链接

Cheng Z. (Invited, Digital Presentation) Thermal Conductance across Heterogeneously Integrated Interfaces for Thermal Management of Wide and Ultra-Wide Bandgap Electronics. Electrochemical Society Meeting Abstracts 241. 2022;(31):1318-1318.

Cheng Z, Shi J, Graham S. Fundamental understanding of thermal transport across solid interfaces. In: Thermal Management of Gallium Nitride Electronics. Elsevier; 2022. pp. 69-82.