First Demonstration of Three-Dimensional Thermal Conductivity Distribution Measurements of Interconnect Stacks Down to 3 nm Process Nodes

Citation:

Huang Z, Yang K, He Y, Dong Z, Sun Z, TANG X, Li M, WANG R, Cheng Z. First Demonstration of Three-Dimensional Thermal Conductivity Distribution Measurements of Interconnect Stacks Down to 3 nm Process Nodes, in IEEE IEDM.; 2025.

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2015 (8)
2014 (2)