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科研成果 by Year: 2026

2026
Guo X, Chen Z, Huang Z, Wang Y, Liu J, Cheng Z. High Thermal Conductivity in Back-End-of-Line Compatible AlN Thin Films. arXiv preprint arXiv:2603.07115. 2026.
Wei Y, Xu H, Zhang X, Wang W, Cheng Z. Ultralow and Tunable Thermal Conductivity of Parylene C for Thermal Insulation in Advanced Packaging. arXiv preprint arXiv:2603.03737. 2026.
Liu J, Huang Z, Yang L, Zhang Y, Zhang X, Zhang K, Guo X, Wang Y, Zhou H, Zhang J. Ion Implantation Enhanced Nucleation Facilitates Heat Transport across Atomically-Sharp Semiconductor Interfaces. arXiv preprint arXiv:2602.13827. 2026.
Zhang X, Chang L, Li L, Cheng Z. Thermal conductance across bonded SiOx-SiOx interfaces in hybrid bonding process. arXiv preprint arXiv:2601.03106. 2026.
He Y, Huang Z, Li M, WANG R, Cheng Z. Thermal Conductivity Mapping of Interconnects and Active Layers of Logic Chips, in EDTM. IEEE; 2026.
Huang Z, Liang J, Wang Y, Sun Z, Shigekawa N, Li M, WANG R, Cheng Z. Experimental Observation of Extremely Strong Defect-Phonon Scatterings in Cubic SiC Single Crystals. Applied Physics Reviews. 2026.