Huang Z, Yang Y, Sheng D, Li H, Wang Y, Sun Z, Li M, WANG R, HUANG R, Cheng Z. Thermal Conductivity of Cubic Silicon Carbide Single Crystals Heavily Doped by Nitrogen. arXiv preprint arXiv:2409.18843. 2024.

Xiong Y, Li S, Wang R, Cheng Z, Yang J, Li D, Liu X, Xu D. Ultralow Contact Thermal Resistance between Bismuth Selenide Nanoribbons Achieved by Current-Induced Annealing. ACS Applied Materials & Interfaces. 2024;16(42):57824-57831.

Cheng Z, Huang Z, Sun J, Wang J, Feng T, Ohnishi K, Liang J, Amano H, HUANG R. (Ultra) wide bandgap semiconductor heterostructures for electronics cooling. Applied Physics Reviews. 2024;11(4).

Ji X, Huang Z, Ohno Y, Inoue K, Nagai Y, Sakaida Y, Uratani H, Sun J, Shigekawa N, Liang J, et al. Interfacial reaction boosts thermal conductance of room‐temperature integrated semiconductor interfaces stable up to 1100° C. Advanced Electronic Materials. 2024:2400387.

Masten HN, Lundh JS, Feygelson TI, Sasaki K, Cheng Z, Spencer JA, Liao P-Y, Hite JK, Pennachio DJ, Jacobs AG. Reduced temperature in lateral (AlxGa1− x) 2O3/Ga2O3 heterojunction field effect transistor capped with nanocrystalline diamond. Applied Physics Letters. 2024;124(15).

Li R, Hussain K, Liao ME, Huynh K, Bin Hoque MS, Wyant S, Koh YR, Xu Z, Wang Y, Luccioni DP. Enhanced Thermal Boundary Conductance across GaN/SiC Interfaces with AlN Transition Layers. ACS Applied Materials & Interfaces. 2024.

Cheng Z, Huang Y-J, Zahiri B, Kwon P, Braun PV, Cahill DG. Ionic Peltier effect in Li-ion electrolytes. Physical Chemistry Chemical Physics. 2024.

Sun J, Cheng Z, Liang J, Shigekawa N, Kawamura K, Uratani H, Sakaida Y, Cahill DG. Probe beam deflection technique with liquid immersion for fast mapping of thermal conductance. Applied Physics Letters. 2024;124(4).

Liao ME, Huynh K, Cheng Z, Shi J, Graham S, Goorsky MS. Thermal transport and structural improvements due to annealing of wafer bonded β-Ga2O3| 4H-SiC. Journal of Vacuum Science & Technology A. 2023;41(6).

Kagawa R, Cheng Z, Kawamura K, Ohno Y, Moriyama C, Sakaida Y, Ouchi S, Uratani H, Inoue K, Nagai Y. High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes. Small. 2023:2305574.

Lee H, Zhou Y, Jung S, Li H, Cheng Z, He J, Chen J, Sokalski P, Dolocan A, Gearba‐Dolocan R. High‐Pressure Synthesis and Thermal Conductivity of Semimetallic θ‐Tantalum Nitride. Advanced Functional Materials. 2023:2212957.

Feng T, Zhou H, Cheng Z, Larkin L, Neupane M. A Critical Review of Thermal Transport across Wide and Ultrawide Bandgap Semiconductor Interfaces. ACS Applied Materials & Interfaces [Internet]. 2023;15(25):29655–29673. 访问链接

Cheng Z, Zahiri B, Kwon P, Braun PV, Cahill DG. Ionic Peltier Effect in Li Ion Battery Electrolytes. arXiv preprint arXiv:2211.14949. 2022.

Liang* J, Nagai H, Cheng* Z, Kawamura K, Shimizu Y, Ohno Y, Sakaida Y, Uratani H, Yoshida H, Nagai Y. Selective Direct Bonding of High Thermal Conductivity 3C-SiC Film to β-Ga2O3 for Top-Side Heat Extraction. arXiv preprint arXiv:2209.05669. 2022.

Cheng Z, Liang J, Kawamura K, Zhou H, Asamura H, Uratani H, Tiwari J, Graham S, Ohno Y, Nagai Y. High thermal conductivity in wafer-scale cubic silicon carbide crystals. Nature Communications. 2022;13(1):7201.

Cheng* Z, Ji X, Cahill DG. Battery absorbs heat during charging uncovered by ultra-sensitive thermometry. Journal of Power Sources. 2022;518:230762.

Cheng* Z, Graham S, Amano H, Cahill DG. Perspective on thermal conductance across heterogeneously integrated interfaces for wide and ultrawide bandgap electronics. Applied Physics Letters. 2022;120(3):030501.

Green AJ, Speck J, Xing G, Moens P, Allerstam F, Gumaelius K, Neyer T, Arias-Purdue A, Mehrotra V, Kuramata A. Roadmap – β-Gallium oxide power electronics. APL Materials. 2022;10(2):029201.

Shi J, Yuan C, Huang H-L, Johnson J, Chae C, Wang S, Hanus R, Kim S, Cheng Z, Hwang J. Thermal Transport across Metal/β-Ga2O3 Interfaces. ACS Applied Materials & Interfaces. 2021;13(24):29083–29091.

Cheng Z, Zahiri B, Ji X, Chen C, Chalise D, Braun PV, Cahill DG. Good Solid‐State Electrolytes Have Low, Glass‐Like Thermal Conductivity. Small. 2021:2101693.