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科研成果 by Type: Conference Paper

2026
He Y, Huang Z, Li M, WANG R, Cheng Z. Thermal Conductivity Mapping of Interconnects and Active Layers of Logic Chips, in EDTM. IEEE; 2026.
2025
Huang Z, Yang K, He Y, Dong Z, Sun Z, TANG X, Li M, WANG R, Cheng Z. First Demonstration of Three-Dimensional Thermal Conductivity Distribution Measurements of Interconnect Stacks Down to 3 nm Process Nodes, in IEEE IEDM.; 2025.