Ji X, Cheng Z, Pek EK, Cahill DG. Thermal Conductivity Mapping of Oxidized SiC SiC Composites by Time Domain Thermoreflectance with Heterodyne Detection. Journal of the American Ceramic Society. 2021;104:4773–4781.

Bin Hoque MS, Koh YR, Braun JL, Mamun A, Liu Z, Huynh K, Liao ME, Hussain K, Cheng Z, Hoglund ER. High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films. ACS nano. 2021;15(6):9588–9599.

Cheng Z, Li R, Yan X, Jernigan G, Shi J, Liao ME, Hines NJ, Gadre CA, Idrobo JC, Lee E. Experimental Observation of Localized Interfacial Phonon Modes. Nature Communications. 2021;12(1):6901.

Hines NJ, Yates L, Foley BM, Cheng Z, Bougher TL, Goorsky MS, Hobart KD, Feygelson TI, Tadjer MJ, Graham S. Steady-state methods for measuring in-plane thermal conductivity of thin films for heat spreading applications. Review of Scientific Instruments. 2021;92(4):044907.

Muraleedharan MG, Gordiz K, Rohskopf A, Wyant ST, Cheng Z, Graham S, Henry A. Understanding Phonon Transport Properties Using Classical Molecular Dynamics Simulations. arXiv preprint arXiv:2011.01070. 2020.

Koh YR, Cheng Z, Mamun A, Bin Hoque MS, Liu Z, Bai T, Hussain K, Liao ME, Li R, Gaskins JT. Bulk-like intrinsic phonon thermal conductivity of micrometer thick AlN films. ACS Applied Materials & Interfaces. 2020;12(26):29443–29450.

Cheng Z, Wheeler VD, Bai T, Shi J, Tadjer MJ, Feygelson T, Hobart KD, Goorsky MS, Graham S. Integration of polycrystalline Ga2O3 on diamond for thermal management. Applied Physics Letters. 2020;116(6):062105.

Cheng Z, Koh YR, Mamun A, Shi J, Bai T, Huynh K, Yates L, Liu Z, Li R, Lee E. Experimental observation of high intrinsic thermal conductivity of AlN. Physical Review Materials. 2020;4(4):044602.

Cheng Z, Koh YR, Ahmad H, Hu R, Shi J, Liao ME, Wang Y, Bai T, Li R, Lee E. Thermal Conductance Across Harmonic-matched Epitaxial Al-sapphire Heterointerfaces. Communications Physics. 2020;3(115).

Cheng Z, Mu F, Yates L, Suga T, Graham S. Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices. ACS Applied Materials & Interfaces. 2020;12(7):8376-8384.

Cheng Z, Mu F, You T, Xu W, Shi J, Liao ME, Wang Y, Huynh K, Suga T, Goorsky MS. Thermal Transport across Ion-Cut Monocrystalline β-Ga2O3 Thin Films and Bonded β-Ga2O3–SiC Interfaces. ACS Applied Materials & Interfaces. 2020;12(40):44943-44951.

Muraleedharan MG, Gordiz K, Rohskopf A, Wyant ST, Cheng Z, Graham S, Henry A. Understanding phonon transport properties using classical molecular dynamics simulations. arXiv preprint arXiv:2011.01070. 2020.

Cheng Z, Wheeler VD, Bai T, Shi J, Tadjer MJ, Feygelson T, Hobart KD, Goorsky MS, Graham S. Integration of polycrystalline Ga2O3 on diamond for thermal management. Applied Physics Letters. 2020;116(6):062105.

Cheng Z, Weidenbach A, Feng T, Tellekamp BM, Howard S, Wahila MJ, Zivasatienraj B, Foley B, Pantelides ST, Piper LFJ. Diffuson-driven ultralow thermal conductivity in amorphous Nb2O5 thin films. Physical Review Materials. 2019;3(2):025002.

Cheng Z, Bai T, Shi J, Feng T, Wang Y, Mecklenburg M, Li C, Hobart KD, Feygelson TI, Tadjer MJ. Tunable Thermal Energy Transport across Diamond Membranes and Diamond–Si Interfaces by Nanoscale Graphoepitaxy. ACS applied materials & interfaces. 2019;11(20):18517-18527.

Mu* F, Cheng* Z, Shi J, Shin S, Xu B, Shiomi J, Graham S, Suga T. High Thermal Boundary Conductance across Bonded Heterogeneous GaN-SiC Interfaces. ACS Applied Materials & Interfaces. 2019;11(36):33428–33434.

Cheng Z, Tanen N, Chang C, Shi J, McCandless J, Muller D, Jena D, Xing HG, Graham S. Significantly reduced thermal conductivity in β-(Al0.1Ga0.9)2O3/Ga2O3 superlattices. Applied Physics Letters. 2019;115(9):092105.

Cheng Z, Yates L, Shi J, Tadjer MJ, Hobart KD, Graham S. Thermal conductance across β-Ga2O3-diamond van der Waals heterogeneous interfaces. APL Materials. 2019;7(3):031118.

Cheng Z, Tanen N, Chang C, Shi J, McCandless J, Muller D, Jena D, Xing HG, Graham S. Significantly reduced thermal conductivity in β-(Al0. 1Ga0. 9) 2O3/Ga2O3 superlattices. Applied Physics Letters. 2019;115(9):092105.

Mu F, Cheng Z, Shi J, Shin S, Xu B, Shiomi J, Graham S, Suga T. High thermal boundary conductance across bonded heterogeneous GaN–SiC interfaces. ACS applied materials & interfaces. 2019;11(36):33428-33434.