Kagawa R, Cheng Z, Kawamura K, Ohno Y, Moriyama C, Sakaida Y, Ouchi S, Uratani H, Inoue K, Nagai Y. High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes. Small. 2023:2305574.

Lee H, Zhou Y, Jung S, Li H, Cheng Z, He J, Chen J, Sokalski P, Dolocan A, Gearba‐Dolocan R. High‐Pressure Synthesis and Thermal Conductivity of Semimetallic θ‐Tantalum Nitride. Advanced Functional Materials. 2023:2212957.

Feng T, Zhou H, Cheng Z, Larkin L, Neupane M. A Critical Review of Thermal Transport across Wide and Ultrawide Bandgap Semiconductor Interfaces. ACS Applied Materials & Interfaces [Internet]. 2023;15(25):29655–29673. 访问链接

Cheng Z. (Invited, Digital Presentation) Thermal Conductance across Heterogeneously Integrated Interfaces for Thermal Management of Wide and Ultra-Wide Bandgap Electronics. Electrochemical Society Meeting Abstracts 241. 2022;(31):1318-1318.

Cheng Z, Shi J, Graham S. Fundamental understanding of thermal transport across solid interfaces. In: Thermal Management of Gallium Nitride Electronics. Elsevier; 2022. pp. 69-82.

Cheng Z, Zahiri B, Kwon P, Braun PV, Cahill DG. Ionic Peltier Effect in Li Ion Battery Electrolytes. arXiv preprint arXiv:2211.14949. 2022.

Lundh JS, Masten HN, Sasaki K, Jacobs AG, Cheng Z, Spencer J, Chen L, Gallagher J, Koehler AD, Konishi K. AlN-capped β-(AlxGal-x)2O3/Ga2O3 heterostructure field-effect transistors for near-junction thermal management of next generation power devices. 2022 Device Research Conference (DRC). 2022:1-2.

Cheng Z, Liang J, Kawamura K, Zhou H, Asamura H, Uratani H, Tiwari J, Graham S, Ohno Y, Nagai Y. High thermal conductivity in wafer-scale cubic silicon carbide crystals. Nature Communications. 2022;13(1):7201.

Liang* J, Nagai H, Cheng* Z, Kawamura K, Shimizu Y, Ohno Y, Sakaida Y, Uratani H, Yoshida H, Nagai Y. Selective Direct Bonding of High Thermal Conductivity 3C-SiC Film to β-Ga2O3 for Top-Side Heat Extraction. arXiv preprint arXiv:2209.05669. 2022.

Cheng* Z, Ji X, Cahill DG. Battery absorbs heat during charging uncovered by ultra-sensitive thermometry. Journal of Power Sources. 2022;518:230762.

Cheng* Z, Graham S, Amano H, Cahill DG. Perspective on thermal conductance across heterogeneously integrated interfaces for wide and ultrawide bandgap electronics. Applied Physics Letters. 2022;120(3):030501.

Green AJ, Speck J, Xing G, Moens P, Allerstam F, Gumaelius K, Neyer T, Arias-Purdue A, Mehrotra V, Kuramata A. Roadmap – β-Gallium oxide power electronics. APL Materials. 2022;10(2):029201.

Cheng* Z, Graham S. Room-temperature bonded thermally conductive semiconductor interfaces. In: Thermal Management of Gallium Nitride Electronics. Woodhead Publishing; 2022. pp. 359-377.

Cheng Z, Zahiri B, Ji X, Chen C, Chalise D, Braun PV, Cahill DG. Good Solid‐State Electrolytes Have Low, Glass‐Like Thermal Conductivity. Small. 2021:2101693.

Cheng Z, Lu W, Shi J, Tanaka D, Protik NH, Wang S, Iwaya M, Takeuchi T, Kamiyama S, Akasaki I. Quasi-ballistic thermal conduction in 6H–SiC. Materials Today Physics. 2021;20:100462.

Yates L, Cheng Z, Bai T, Hobart K, Tadjer M, Feygelson TI, Pate BB, Goorsky M, Graham S. Simultaneous Evaluation of Heat Capacity and In-plane Thermal Conductivity of Nanocrystalline Diamond Thin Films. Nanoscale and Microscale Thermophysical Engineering. 2021;25(3-4):166-178.

Shi J, Yuan C, Huang H-L, Johnson J, Chae C, Wang S, Hanus R, Kim S, Cheng Z, Hwang J. Thermal Transport across Metal/β-Ga2O3 Interfaces. ACS Applied Materials & Interfaces. 2021;13(24):29083–29091.

Cheng Z, Mu F, Ji X, You T, Xu W, Suga T, Ou X, Cahill DG, Graham S. Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance. ACS Applied Materials & Interfaces. 2021;13(27):31843–31851.

Cheng Z, Li R, Yan X, Jernigan G, Shi J, Liao ME, Hines NJ, Gadre CA, Idrobo JC, Lee E. Experimental Observation of Localized Interfacial Phonon Modes. Nature Communications. 2021;12(1):6901.

Bin Hoque MS, Koh YR, Braun JL, Mamun A, Liu Z, Huynh K, Liao ME, Hussain K, Cheng Z, Hoglund ER. High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films. ACS nano. 2021;15(6):9588–9599.