@conference {40009,
	title = {First Demonstration of Three-Dimensional Thermal Conductivity Distribution Measurements of Interconnect Stacks Down to 3 nm Process Nodes},
	booktitle = {IEEE IEDM},
	year = {2025},
	author = {Huang, Zifeng and Kaiqi Yang and Yiyun He and Zuoyuan Dong and Sun, Zixuan and Xiyuan TANG and Ming Li and Runsheng WANG and Cheng, Zhe}
}
