First Demonstration of Three-Dimensional Thermal Conductivity Distribution Measurements of Interconnect Stacks Down to 3 nm Process Nodes - Huang, Zifeng; Kaiqi Yang; Yiyun He; Zuoyuan Dong; Sun, Zixuan; Xiyuan TANG; Ming Li; Runsheng WANG; Cheng, Zhe (IEEE IEDM, 2025)