Citation:
Jing Y, Wu M, Zhou J, Sun Y, Ma Y, HUANG R, Ye L, Jia T. AIG-CIM: A Scalable Chiplet Module with Tri-Gear Heterogeneous Compute-in-Memory for Diffusion Acceleration, in Design Automation Conference (DAC).; 2024.
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北京大学微纳电子大厦
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