NEWS

Two papers are accepted by ISSCC 2026.

十一月 25, 2025

Congratulations to Jiaqi and Wenjie. We will present two AI accelerator chips for visual content generation and multi-speaker ASR tasks.

Two papers are accepted by DATE 2026.

十一月 8, 2025

Congratulations to Kangbo and Hongou (senior-year undergrad). We will present our chiplet-level architecture modeling and explorations for agentic LLM and optical interconnects.

[Award] We received ISLPED 2025 Best Paper Award.

[Award] We received ISLPED 2025 Best Paper Award.

八月 9, 2025

It is honor to receive ISLPED 2025 Best Paper Award, congratulations to the team!

GenSoC is a methodology exploration to leverage multi-agent LLMs for agile SoC design leveraging open-source hardware.

Three papers are accepted by ICCAD 2025.

七月 1, 2025

Congratulations to Siyuan and Wenjie. We will present both near-memory (3D-based and LPDDR-based) and in-memory (SRAM-based) acceleration solutions with co-optimization considerations with algorithm, thermal, and testing.

One paper is accepted by VLSI 2025.

三月 28, 2025

Congratulations to Yanchi. We will present a distributed power management solution with learning capability for AI processor.

Three papers are accepted by DAC 2025.

二月 16, 2025

Congratulations to Kangbo, Yiyang and Wentao. We will present three accelerator designs for Multimodal LLM, 3D Gaussian Splatting, and LLM inference with 3D stacked memory. 

One paper is accepted by DATE 2025.

十一月 19, 2024
Congratulations to Zhantong (senior-year undergrad). We demonstrate CIM has great efficiency benefits for the generative model inference in TPU architecture.

One paper is accepted by ISSCC 2025.

十月 15, 2024
Congratulations to Yiqi. A Diffusion accelerator with efficient compute-in-memory for multi purpose content generation will be presented.

Two papers are accepted by ICCAD 2024.

七月 1, 2024

Congratulations to Yanchi. A power modeling and analysis framework for LLM chiplets and a SoC thermal optimization solution (collaborated with Prof. Yibo Lin) will be presented.