This paper presents a wideband integrated dielectric sensor with read-out circuit at 207-257 GHz in SiGe BiCMOS technology. The sensing element is equipped by a resonator that provides a bandpass frequency response which is varied in accordance to the carried permittivity change of the device under test. This variation can be sensed and recorded as the change of output voltage of an integrated 207-257 GHz 2 port vector network analyzer readout circuit. The demonstration of aforementioned readout system is verified by measuring the output of mixers as the reference, reflected and measured channel, and the uncalibrated S parameters of readout with different samples.

This paper presents a 60 GHz phase shifter, based on a coplanar waveguide (CPW) transmission line, loaded with ferroelectric hafnium zirconium oxide (HZO) variable metal-insulator-metal (MIM) varactors, developed for the back-end-of-line (BEoL) on-chip integration. Using the measured data of capacitance-voltage (C-V) characteristics of HZO and implementing the method-of-moments simulation, it was shown, that by changing the bias voltage between 0.95 and -3 V, the device shows a phase shift of 111° and a minimum insertion loss of -5.84 dB at 60 GHz. The chip area of the device is 0.206 mm 2 , making it the smallest among non-CMOS phase shifters.

This paper presents a tunable 60 GHz band-pass filter, based on a coplanar waveguide (CPW) transmission line, periodically loaded with ferroelectric Hafnium Zirconium Oxide (HZO) variable metal-ferroelectric-metal (MIM) capacitors (varactors), developed for back-end-of-line (BEoL) integration. Derived from the nonlinear capacitance of hafnium zirconium oxide and implementing the method-of-moments simulation, it was shown, that with changing the bias voltage between 0.95 and -3 V, the filter’s center frequency can be tuned between 60.5 and 69,7 GHz, respectively. Hereby, a minimum insertion loss of -3.3 dB is realized. The chip area of the filter is only 0.062 mm 2 , making it the smallest among tunable V-band filters.

This work presents a detailed study on the high-frequency performance of 22FDX ® FDSOI for 5G front-end power amplifiers. The following report focuses on the S-parameters and large-signal figure-of-merits such as output power, gain and power-added efficiency for an insightful and correct assessment on the device capability. DC characteristics of the test transistors are firstly investigated to determine the optimum operating point. Small-signal characterization is performed up to 110 GHz using a state-of-the-art mm-Wave measurement setup. An overall MSG/MAG of 16 ± 4 dB is recorded in the frequency range 10 - 80 GHz. On the other hand, large-signal performance on non-50 Ohm impedance environment is evaluated thoroughly through vector-receiver load-pull measurement up to 24 GHz. The measured output power and efficiency indicate that the DUTs perform well in the sub-6 GHz band and even in K-band. The outstanding experimental results emphasize the applicability and suitability of the 22FDX ® FDSOI technology platform for 5G low-power transmitters.

This paper investigates the applicability of a thick-oxide transistor from the 22FDX® for 5G NR sub-6 GHz front-end modules. Characterization and evaluation of the GlobalFoundries's FDSOI n-MOSFET regarding RF front-end figure-of-merits, such as output power, efficiency and linearity are discussed. Load-pull measurements are performed to extract the optimal performance. The test transistor delivers saturation power of +5.0 dBm and more than 65% of PAE while maintaining flat transducer gain of 10.2 ± 0.2 dB across the targeted frequency range for a 1.5 V single-ended class AB operation. Besides, the low PAE roll-off in term of reducing supply voltage and the particular 60% PAE at 10 dB output back-off indicate that the DUTs are well suitable for envelope tracking applications. Additional reliability tests at strong compression levels are conducted from which low performance degradation over time is observed even at 9 dB output compression.

This article presents a fully differential power-tuning heterodyne on-chip sensing readout system at 240 GHz. The chip enables the measurement of not only the transmission parameter but also the reflection parameter to sense the permittivity of different materials by using four heterodyne mixer-based receiving channels connected to a dielectric sensing element. To facilitate the operation and characterization, three frequency multiplier chains are included to generate the required two identical radio frequency (RF) and one local oscillator (LO) subterahertz signals. RF frequency multiplier chain is configured to enable a tunable power level of the RF signal by using a variable attenuator. A chip prototype using 130-nm silicon–germanium (SiGe) BiCMOS is implemented with a size of 11 mm 2 and dc power consumption of 2.7 W. The measured 10-dB bandwidth of 20.8% is achieved in a frequency range from 207 to 257 GHz with 14-dB measured power-tuning range. The transmission and reflection parameters’ measurements for copper and gummi show a differentiated value in terms of magnitude and phase, which demonstrates the sensing function of the proposed readout system.

In this paper, a comprehensive analysis on small-signal modeling of mm-wave transistor in 22nm FDSOI technology is presented. The model is constructed based on experimental S-parameters up to 110 GHz of a 22FDX® thick-oxide n-MOSFET and analytical parameter extraction approach. The non-quasi static effect is addressed thoroughly in the equivalent circuit model for high frequency validity. The bias-dependent series source and drain resistances are considered to account for the overlap regions between the gate and the highly doped source/drain regions. In addition, a simple RC network is included at the output to model the innegligible substrate coupling at mm-wave frequencies. Excellent agreements between model prediction and measurement are observed in the interested bandwidth for various bias conditions.