Cheng* Z, Graham S, Amano H, Cahill DG. Perspective on thermal conductance across heterogeneously integrated interfaces for wide and ultrawide bandgap electronics. Applied Physics Letters. 2022;120(3):030501.

Green AJ, Speck J, Xing G, Moens P, Allerstam F, Gumaelius K, Neyer T, Arias-Purdue A, Mehrotra V, Kuramata A. Roadmap – β-Gallium oxide power electronics. APL Materials. 2022;10(2):029201.

Cheng* Z, Graham S. Room-temperature bonded thermally conductive semiconductor interfaces. In: Thermal Management of Gallium Nitride Electronics. Woodhead Publishing; 2022. pp. 359-377.

Cheng Z, Zahiri B, Ji X, Chen C, Chalise D, Braun PV, Cahill DG. Good Solid‐State Electrolytes Have Low, Glass‐Like Thermal Conductivity. Small. 2021:2101693.

Cheng Z, Lu W, Shi J, Tanaka D, Protik NH, Wang S, Iwaya M, Takeuchi T, Kamiyama S, Akasaki I. Quasi-ballistic thermal conduction in 6H–SiC. Materials Today Physics. 2021;20:100462.

Yates L, Cheng Z, Bai T, Hobart K, Tadjer M, Feygelson TI, Pate BB, Goorsky M, Graham S. Simultaneous Evaluation of Heat Capacity and In-plane Thermal Conductivity of Nanocrystalline Diamond Thin Films. Nanoscale and Microscale Thermophysical Engineering. 2021;25(3-4):166-178.

Shi J, Yuan C, Huang H-L, Johnson J, Chae C, Wang S, Hanus R, Kim S, Cheng Z, Hwang J. Thermal Transport across Metal/β-Ga2O3 Interfaces. ACS Applied Materials & Interfaces. 2021;13(24):29083–29091.

Cheng Z, Mu F, Ji X, You T, Xu W, Suga T, Ou X, Cahill DG, Graham S. Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance. ACS Applied Materials & Interfaces. 2021;13(27):31843–31851.

Cheng Z, Li R, Yan X, Jernigan G, Shi J, Liao ME, Hines NJ, Gadre CA, Idrobo JC, Lee E. Experimental Observation of Localized Interfacial Phonon Modes. Nature Communications. 2021;12(1):6901.

Bin Hoque MS, Koh YR, Braun JL, Mamun A, Liu Z, Huynh K, Liao ME, Hussain K, Cheng Z, Hoglund ER. High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films. ACS nano. 2021;15(6):9588–9599.

Hines NJ, Yates L, Foley BM, Cheng Z, Bougher TL, Goorsky MS, Hobart KD, Feygelson TI, Tadjer MJ, Graham S. Steady-state methods for measuring in-plane thermal conductivity of thin films for heat spreading applications. Review of Scientific Instruments. 2021;92(4):044907.

Ji X, Cheng Z, Pek EK, Cahill DG. Thermal Conductivity Mapping of Oxidized SiC SiC Composites by Time Domain Thermoreflectance with Heterodyne Detection. Journal of the American Ceramic Society. 2021;104:4773–4781.

Mamun A, Hussain K, Jewel MU, Mollah S, Huynh K, Liao ME, Bai T, Koh YR, Cheng Z, Bin Hoque MS. Thick AlN Templates By MOCVD for the Thermal Management of III-N Electronics. ECS Meeting Abstracts. 2021;(33):1075.

Hobart KD, Feygelson TI, Tadjer MJ, Anderson TJ, Koehler AD, Graham Jr S, Goorsky M, Cheng Z, Yates L, Bai T.; 2021. Diamond on nanopatterned substrate. United States of America patent US

Cheng Z, Shi J, Yuan C, Kim S, Graham S. Thermal science and engineering of β-Ga2O3 materials and devices. In: Ultrawide Bandgap Semiconductors. Academic Press; 2021. pp. 77.

Muraleedharan MG, Gordiz K, Rohskopf A, Wyant ST, Cheng Z, Graham S, Henry A. Understanding Phonon Transport Properties Using Classical Molecular Dynamics Simulations. arXiv preprint arXiv:2011.01070. 2020.

Koh YR, Cheng Z, Mamun A, Bin Hoque MS, Liu Z, Bai T, Hussain K, Liao ME, Li R, Gaskins JT. Bulk-like intrinsic phonon thermal conductivity of micrometer thick AlN films. ACS Applied Materials & Interfaces. 2020;12(26):29443–29450.

Cheng Z, Koh YR, Mamun A, Shi J, Bai T, Huynh K, Yates L, Liu Z, Li R, Lee E. Experimental observation of high intrinsic thermal conductivity of AlN. Physical Review Materials. 2020;4(4):044602.

Cheng Z, Wheeler VD, Bai T, Shi J, Tadjer MJ, Feygelson T, Hobart KD, Goorsky MS, Graham S. Integration of polycrystalline Ga2O3 on diamond for thermal management. Applied Physics Letters. 2020;116(6):062105.

Cheng Z, Mu F, Yates L, Suga T, Graham S. Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices. ACS Applied Materials & Interfaces. 2020;12(7):8376-8384.