Citation:
Jing, Yiqi, Meng Wu, Jiaqi Zhou, Yiyang Sun, Yufei Ma, Ru HUANG, Le Ye*, and Tianyu Jia*. “AIG-CIM: A Scalable Chiplet Module with Tri-Gear Heterogeneous Compute-in-Memory for Diffusion Acceleration.” ACM/IEEE Design Automation Conference (DAC), 2024. Copy at http://www.tinyurl.com/25x7az4x