科研成果 by Type: Conference Proceedings

2020
Ma Y, Du Y, Du L, Lin J, Wang Z. In-Memory Computing: The Next-Generation AI Computing Paradigm. ACM Great Lakes Symposium on VLSI (GLSVLSI) [Internet]. 2020. Links
Sun Z, Pedretti G, Ambrosi E, Bricalli A, Ielmini D. In-Memory PageRank Using a Crosspoint Array of Resistive Switching Memory (RRAM) Devices. 2020 2nd IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS) [Internet]. 2020. 访问链接
Zhai W, Yu J, Zhu D *, Han B, Miao S, Cheng C, Xie P. A management system for forestry remote sensing images based on the global subdivision model. IEEE Geoscience and Remote Sensing Symposium (IGARSS). 2020:3111-3114.
Microwave and Millimeter Wave Sensors for Industrial, Scientific and Medical Applications in BiCMOS Technology
Wessel J, Schmalz K, Yadav RK, Zarrin PS, Jamal FI, Wang D, Fischer G. Microwave and Millimeter Wave Sensors for Industrial, Scientific and Medical Applications in BiCMOS Technology. 2020 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) [Internet]. 2020:241-243. 访问链接Abstract
This work gives an overview of integrated microwave to millimeter wave sensors and their applications covering frequencies from 28 GHz to 240 GHz. The designs are capable to address versatile application fields from liquid compound measurements to plaque detection and classification in arteries, glucose detection in continuous glucose monitoring (CGS) systems and virus detection in the context of respiratory diseases. The demonstrated approaches represent powerful and miniaturized solutions for highly sensitive contactless sensing of sample properties. Exploiting millimeter wave frequencies enables highest levels of integration to implement miniaturized sensing solutions including on-chip readout systems.
Liu C, Song X, Liu H, Belkin NJ. Modelling Knowledge Change Behaviors in Learning-related Tasks. . Proceedings of CIKM 2020 Workshop: 1st International Workshop on Investigating Learning During Web Search. 2020.
Yang Y, Zhu D, Ren F, Cheng C. A novel self-taught learning framework using spatial pyramid matching for scene classification. International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences. 2020:725–729.
Chen Z, Ma* Y, Wang Z. Optimizing Stochastic Computing for Low Latency Inference of Convolutional Neural Networks. IEEE/ACM International Conference on Computer Aided Design (ICCAD) [Internet]. 2020. Links
Li Y, Luo J, Huang Q, An X, Ye L, HUANG R. A Physical Current Model for Multi-Finger Gate Tunneling FET with Schottky Junction. 2020 China Semiconductor Technology International Conference (CSTIC). 2020:1-3.
Li Y, Luo J, Huang Q, An X, Ye L, HUANG R. A Physical Current Model for Multi-Finger Gate Tunneling FET with Schottky Junction. 2020 China Semiconductor Technology International Conference (CSTIC). 2020:1-3.
Krishnan G, Ma Y, Cao Y. Small-world-based Structural Pruning for Efficient FPGA Inference of Deep Neural Networks. IEEE International Conference on Solid-State & Integrated Circuit Technology (ICSICT) [Internet]. 2020. Links
Yang S, Fichman P, Zhu X, Sanfilippo M, Li S, Fleischmann KR. The Use of ICT During COVID-19. Panels & Alternative Events. ASIS&T 83rd Annual Meeting. 2020.
Zhang Y, Liu C. Users’ Knowledge Use and Change during Information Searching Process: A Perspective of Vocabulary Usage. In the proceedings of JCDL’ 20. 2020.
W-Band Noise Characterization with Back-Gate Effects for Advanced 22nm FDSOI mm-Wave MOSFETs
Le QH, Huynh DK, Wang D, Zhao Z, Lehmann S, Kämpfe T, Rudolph M. W-Band Noise Characterization with Back-Gate Effects for Advanced 22nm FDSOI mm-Wave MOSFETs. 2020 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) [Internet]. 2020:131-134. 访问链接Abstract
This paper presents the W-band noise performance of the 22nm FDSOI CMOS technology. In detail, the mm-wave thin-oxide MOSFETs is characterized comprehensively in term of device geometries using the tuner-based noise measurement approach. To aid the noise analysis and extraction, the following study adopts an accurate small-signal equivalent circuit model validated well with bias-dependence up to 110 GHz. The effects of back-gate bias to the overall noise performance are also addressed in this work. The test devices exhibit low noise figure in the full W-band 75-110 GHz. Besides, NF min of 2.8 dB and 3.6 dB is recorded at 94 GHz respectively for the n- and p-FETs with 18nm gate-length (N f = 32, W f = 1.0 µm). The result of this study indicates the comparable performance of the 22nm FDSOI technology to other candidates for W-band applications.
2019
207-257 GHz Integrated Sensing Readout System with Transducer in a 130-nm SiGe BiCMOS Technology
Wang D, Yun J, Eissa MH, Kucharski M, Schmalz K, Malignaggi A, Wang Y, Borngräber J, Liang Y, Ng HJ, et al. 207-257 GHz Integrated Sensing Readout System with Transducer in a 130-nm SiGe BiCMOS Technology. 2019 IEEE MTT-S International Microwave Symposium (IMS) [Internet]. 2019:496-499. 访问链接Abstract
This paper presents a wideband integrated dielectric sensor with read-out circuit at 207-257 GHz in SiGe BiCMOS technology. The sensing element is equipped by a resonator that provides a bandpass frequency response which is varied in accordance to the carried permittivity change of the device under test. This variation can be sensed and recorded as the change of output voltage of an integrated 207-257 GHz 2 port vector network analyzer readout circuit. The demonstration of aforementioned readout system is verified by measuring the output of mixers as the reference, reflected and measured channel, and the uncalibrated S parameters of readout with different samples.
Wu Z, Geng L. Air pollution inhibits tourists’ pro-environmental behaviour: The role of anxiety and tourism nostalgia . the 25th International Sustainable Development Research Society (ISDRS). 2019.
Cui Y, Wentao Xiong, Hu L, Liu R, Chen X, Geng X, Lv F, Fan W, Hong Y. Applying a machine learning method to obtain long time and spatio-temporal continuous soil moisture over the Tibetan Plateau. IGARSS 2019-2019 IEEE International Geoscience and Remote Sensing Symposium. 2019:6986-6989.
Assessment of a Thick-Oxide Transistor from the 22FDX® Platform for 5G NR sub-6 GHz FEMs
Le QH, Huynh DK, Wang D, Kampfe T, Zhao Z, Lehmann S. Assessment of a Thick-Oxide Transistor from the 22FDX® Platform for 5G NR sub-6 GHz FEMs. 2019 IEEE 2nd 5G World Forum (5GWF) [Internet]. 2019:7-10. 访问链接Abstract
This paper investigates the applicability of a thick-oxide transistor from the 22FDX® for 5G NR sub-6 GHz front-end modules. Characterization and evaluation of the GlobalFoundries's FDSOI n-MOSFET regarding RF front-end figure-of-merits, such as output power, efficiency and linearity are discussed. Load-pull measurements are performed to extract the optimal performance. The test transistor delivers saturation power of +5.0 dBm and more than 65% of PAE while maintaining flat transducer gain of 10.2 ± 0.2 dB across the targeted frequency range for a 1.5 V single-ended class AB operation. Besides, the low PAE roll-off in term of reducing supply voltage and the particular 60% PAE at 10 dB output back-off indicate that the DUTs are well suitable for envelope tracking applications. Additional reliability tests at strong compression levels are conducted from which low performance degradation over time is observed even at 9 dB output compression.
Venkataramanaiah SK, Ma Y, Yin S, Nurvithadhi E, Dasu A, Cao Y, Seo J-S. Automatic Compiler Based FPGA Accelerator for CNN Training. IEEE International Conference on Field Programmable Logic and Applications (FPL) [Internet]. 2019. Links
Luo J, Yu L, Liu T, Yang M, Fu Z, Liang Z, Chen L, Chen C, Liu S, Wu S. Capacitor-less stochastic leaky-FeFET neuron of both excitatory and inhibitory connections for SNN with reduced hardware cost. 2019 IEEE International Electron Devices Meeting (IEDM). 2019:6.4. 1-6.4. 4.
Luo J, Yu L, Liu T, Yang M, Fu Z, Liang Z, Chen L, Chen C, Liu S, Wu S. Capacitor-less stochastic leaky-FeFET neuron of both excitatory and inhibitory connections for SNN with reduced hardware cost. 2019 IEEE International Electron Devices Meeting (IEDM). 2019:6.4. 1-6.4. 4.

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