科研成果 by Type: Conference Proceedings

2023
Dong Y, Jia* T, .., Ma Y, Liang Y, Ye* L, HUANG R. A Model-Specific End-to-End Design Methodology for Resource-Constrained TinyML Hardware. ACM/IEEE Design Automation Conference (DAC) [Internet]. 2023. Links
Xu W, Luo J, Huang Q, HUANG R. A Novel Ferroelectric Tunnel FET-based Time-Domain Content Addressable Memory with High Distance-Metric Linearity and Energy Efficiency for Edge Machine Learning. 2023 Silicon Nanoelectronics Workshop (SNW). 2023:7-8.
Xu W, Luo J, Huang Q, HUANG R. A Novel Ferroelectric Tunnel FET-based Time-Domain Content Addressable Memory with High Distance-Metric Linearity and Energy Efficiency for Edge Machine Learning. 2023 Silicon Nanoelectronics Workshop (SNW). 2023:7-8.
Xu W, Luo J, Huang Q, HUANG R. A novel pulse-width-modulated FeFET-based analog content addressable memory with high area-and energy-efficiency. 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM). 2023:1-3.
Xu W, Luo J, Huang Q, HUANG R. A novel pulse-width-modulated FeFET-based analog content addressable memory with high area-and energy-efficiency. 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM). 2023:1-3.
On-Chip CPW Low-Pass Filter with 50–110 GHz Bandstop in 400 nm Metal Thickness Technology Towards Lab-Level Ka-Band MMICs
Zhuo M, Wu J, Qiu H, Li H, Ding L, Wang D. On-Chip CPW Low-Pass Filter with 50–110 GHz Bandstop in 400 nm Metal Thickness Technology Towards Lab-Level Ka-Band MMICs. 2023 IEEE MTT-S International Wireless Symposium (IWS) [Internet]. 2023:1-3. 访问链接Abstract
This paper presents a millimeter-wave low-pass filter to investigate the RF performance of passive structures in a lab-level thin metal micro-nano processing technology. It consists of 3-stage periodic stepped-impedance cell to have a slow-wave structure to offer a high attenuation of stop band with a compact size. The total size of the chip is less than 1.1 mm 2 . It achieves an insertion loss of less than 2 dB at a frequency range from 0 to 110 GHz with a measured cut-off frequency around 40 GHz. A rejection of higher than 20 dB is measured in a stopband from 52 to 110 GHz, which is larger than 2 times of fundamental frequency. The measurement agrees well with the simulation results. It shows the potential of RF passives in a lab-level thinner metal thickness technology towards monolithic microwave integrated circuits.
Chen P, Wu M, Ma* Y, Ye* L, HUANG R. RIMAC: An Array-level ADC/DAC-free ReRAM-based In-MemoryDNN Processor with Analog Cache and Computation. Asia and South Pacific Design Automation Conference (ASP-DAC) [Internet]. 2023. Links
Jiang D, Xu M, Wang Q. Self-Powered Textile Triboelectric Pulse Sensor for Cardiovascular Monitoring. 2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC). 2023:1-4.
Wu Z, Ma Y, Lu C. Tackling Customer Mistreatment: Roles of Growth Mindset and Job Crafting in Pursuing Career Success. The 83nd Annual Meeting of the Academy of Management [Internet]. 2023. 访问链接
2022
Lundh JS, Masten HN, Sasaki K, Jacobs AG, Cheng Z, Spencer J, Chen L, Gallagher J, Koehler AD, Konishi K. AlN-capped β-(AlxGal-x)2O3/Ga2O3 heterostructure field-effect transistors for near-junction thermal management of next generation power devices. 2022 Device Research Conference (DRC). 2022:1-2.
Tang J, Guo J. An Analysis Method for Online Shopping Platform Comments Based on NLP-AHP: Taking Amazon as An Example. 2022 3rd International Conference on Education, Knowledge and Information Management (ICEKIM). 2022:1080-1085.
Qiu Y, Ma* Y, Zhao W, Wu M, Ye* L, HUANG R. DCIM-GCN: Digital Computing-in-Memory to Efficiently Accelerate Graph Convolutional Networks. IEEE/ACM International Conference on Computer Aided Design (ICCAD) [Internet]. 2022. Links
Wu Z, Lu CQ. The dynamics of career sustainability: A latent transition analysis. The 82nd Annual Meeting of the Academy of Management. 2022.
Bracken C, Broman D, Campbell A, Hou Z, Ou Y, Oikonomou K, Voisin N. Evaluation of renewables' co-variability to support 2035 decarbonization goals. AGU Fall Meeting Abstracts. 2022;2022:GC42Q-0924.
Liu Q, Wu Z, Lu C. Future Work Self and Career Success: An Integrative Perspective of Resource Interaction and Proactive Behavior. The 24nd National Academic Conference of Psychology. 2022.
Huang Q, Yang M, Luo J, Su C, HUANG R. HfO 2-based Ferroelectric Devices for Low Power Applications. 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM). 2022:285-287.
Huang Q, Yang M, Luo J, Su C, HUANG R. HfO 2-based Ferroelectric Devices for Low Power Applications. 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM). 2022:285-287.
Wu Z, Ma Y, Lu CQ. How to sustain proactivity? The dynamic relationship between job performance and job crafting. The 82nd Annual Meeting of the Academy of Management. 2022.
Integration of BEoL Compatible 1T1C FeFET Memory Into an Established CMOS Technology
Lehninger D, Mähne H, Ali T, Hoffmann R, Olivo R, Lederer M, Mertens K, Kämpfe T, K. Integration of BEoL Compatible 1T1C FeFET Memory Into an Established CMOS Technology. 2022 IEEE International Memory Workshop (IMW) [Internet]. 2022:1-4. 访问链接Abstract
Recently, hafnium oxide based ferroelectric memories gained great attention due to good scalability, high speed operation, and low power consumption. In contrast to the FRAM concept, the FeFET offers non-destructive read-out. However, the integration of the FeFET into an established CMOS technology entails several challenges. Herein, an 1T1C FeFET with separated transistor (1T) and ferroelectric capacitor (1C) is described and demonstrated. This alternative approach can be integrated into standard process technologies without introducing significant modifications of the front-end-of-line. All important steps starting from the integration of MFM devices into the BEoL through the fabrication and characterization of single 1T1C memory cells with various capacitor area ratios for bit cell tuning up to the initial demonstration of an 8 kbit test-array are covered.
Cheng Z. (Invited, Digital Presentation) Thermal Conductance across Heterogeneously Integrated Interfaces for Thermal Management of Wide and Ultra-Wide Bandgap Electronics. Electrochemical Society Meeting Abstracts 241. 2022;(31):1318-1318.

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