科研成果 by Type: Conference Proceedings

2023
Ma Y, An X, Wu Z, Liu P, Lu C. Customer Mistreatment and Employees’ Coping Strategies: A Meta-SEM Analysis. The 83rd Annual Meeting of the Academy of Management. 2023.
Jing Y, Sun Y, Wang X, Zhao W, Wu M, Yan F, Ma Y, Ye L, Jia T. DCIM-3DRec: A 3D Reconstruction Accelerator with Digital Computing-in-Memory and Octree-Based Scheduler. IEEE/ACM Int. Symp. on Low Power Electronics and Design (ISLPED) [Internet]. 2023. Links
Fu B, Luo J, Xu W, Huang Q, HUANG R. Design of Ferroelectric FET-Based Capacitive-Coupling Computing-In-Memory For Binary Neural Networks. 2023 China Semiconductor Technology International Conference (CSTIC). 2023:1-4.
Fu B, Luo J, Xu W, Huang Q, HUANG R. Design of Ferroelectric FET-Based Capacitive-Coupling Computing-In-Memory For Binary Neural Networks. 2023 China Semiconductor Technology International Conference (CSTIC). 2023:1-4.
Sheng M, Wang J, Zhu X, Zhang P. An Exploratory Study of Intergenerational Technical Help from the Youth’s Perspective. International Conference on Information. 2023:417-425.
Luo J, Liu T, Fu Z, Wei X, Huang Q, HUANG R. Ferroelectric FET based Signed Synapses of Excitatory and Inhibitory Connection fo Stochastic Spiking Neural Network based Optimizer. 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM). 2023:1-3.
Luo J, Liu T, Fu Z, Wei X, Huang Q, HUANG R. Ferroelectric FET based Signed Synapses of Excitatory and Inhibitory Connection fo Stochastic Spiking Neural Network based Optimizer. 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM). 2023:1-3.
Fu Z, Cao S, Zheng H, Luo J, Huang Q, HUANG R. First demonstration of hafnia-based selector-free FeRAM with high disturb immunity through design technology co-optimization. 2023 International Electron Devices Meeting (IEDM). 2023:1-4.
Fu Z, Cao S, Zheng H, Luo J, Huang Q, HUANG R. First demonstration of hafnia-based selector-free FeRAM with high disturb immunity through design technology co-optimization. 2023 International Electron Devices Meeting (IEDM). 2023:1-4.
Li W, Zhang P, Jun W. Humanities Scholars' Understanding of Data and the Implications for Humanities Data Curation. Proceedings of the Association for Information Science and Technology. 2023;60:1034-1036.
Pan Z, Trusler MJP, Zhang K. Interfacial Dilational Rheology Between Nitrogen and Aqueous Surfactant Solutions: Implications for Foam-Assisted EOR. SPE Annual Technical Conference and Exhibition [Internet]. 2023;Day 2 Tue, October 17, 2023. 访问链接
Dong Y, Jia* T, .., Ma Y, Liang Y, Ye* L, HUANG R. A Model-Specific End-to-End Design Methodology for Resource-Constrained TinyML Hardware. ACM/IEEE Design Automation Conference (DAC) [Internet]. 2023. Links
Xu W, Luo J, Huang Q, HUANG R. A Novel Ferroelectric Tunnel FET-based Time-Domain Content Addressable Memory with High Distance-Metric Linearity and Energy Efficiency for Edge Machine Learning. 2023 Silicon Nanoelectronics Workshop (SNW). 2023:7-8.
Xu W, Luo J, Huang Q, HUANG R. A Novel Ferroelectric Tunnel FET-based Time-Domain Content Addressable Memory with High Distance-Metric Linearity and Energy Efficiency for Edge Machine Learning. 2023 Silicon Nanoelectronics Workshop (SNW). 2023:7-8.
Xu W, Luo J, Huang Q, HUANG R. A novel pulse-width-modulated FeFET-based analog content addressable memory with high area-and energy-efficiency. 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM). 2023:1-3.
Xu W, Luo J, Huang Q, HUANG R. A novel pulse-width-modulated FeFET-based analog content addressable memory with high area-and energy-efficiency. 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM). 2023:1-3.
On-Chip CPW Low-Pass Filter with 50–110 GHz Bandstop in 400 nm Metal Thickness Technology Towards Lab-Level Ka-Band MMICs
Zhuo M, Wu J, Qiu H, Li H, Ding L, Wang D. On-Chip CPW Low-Pass Filter with 50–110 GHz Bandstop in 400 nm Metal Thickness Technology Towards Lab-Level Ka-Band MMICs. 2023 IEEE MTT-S International Wireless Symposium (IWS) [Internet]. 2023:1-3. 访问链接Abstract
This paper presents a millimeter-wave low-pass filter to investigate the RF performance of passive structures in a lab-level thin metal micro-nano processing technology. It consists of 3-stage periodic stepped-impedance cell to have a slow-wave structure to offer a high attenuation of stop band with a compact size. The total size of the chip is less than 1.1 mm 2 . It achieves an insertion loss of less than 2 dB at a frequency range from 0 to 110 GHz with a measured cut-off frequency around 40 GHz. A rejection of higher than 20 dB is measured in a stopband from 52 to 110 GHz, which is larger than 2 times of fundamental frequency. The measurement agrees well with the simulation results. It shows the potential of RF passives in a lab-level thinner metal thickness technology towards monolithic microwave integrated circuits.
Chen P, Wu M, Ma* Y, Ye* L, HUANG R. RIMAC: An Array-level ADC/DAC-free ReRAM-based In-MemoryDNN Processor with Analog Cache and Computation. Asia and South Pacific Design Automation Conference (ASP-DAC) [Internet]. 2023. Links
Jiang D, Xu M, Wang Q. Self-Powered Textile Triboelectric Pulse Sensor for Cardiovascular Monitoring. 2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC). 2023:1-4.
Wu Z, Ma Y, Lu C. Tackling Customer Mistreatment: Roles of Growth Mindset and Job Crafting in Pursuing Career Success. The 83nd Annual Meeting of the Academy of Management [Internet]. 2023. 访问链接

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