九月 15, 2018
![A new GaN MISHEMT process with high uniformity is developed by Sunhui et al. The work is in cooperation with Founder Microelectronics. A new GaN MISHEMT process with high uniformity is developed by Sunhui et al. The work is in cooperation with Founder Microelectronics.](http://scholar.pku.edu.cn/sites/default/files/styles/os_news_full/public/mjwang/files/sunhui1.jpg?itok=ZU9sEUBH)
With the high-quality Si3N4 dielectric by low-pressure chemical vapor deposition (LPCVD) and damage free, self-terminating passivation layer etching at the gate area, the MIS-HEMTs on 150 mm Si substrate demonstrate excellent output performance and good uniformity. The degradation of dynamic on-resistance is only about 42% at a quiescent drain bias of 600 V.