- Characterization and regulation of elastic strain mediated phonon/electron/surface phonon polariton transport
By leveraging strain engineering, we aim to modulate phonon and electron band structures, carrier dynamics, and surface phonon polaritons (SPhP) propagation characteristics. This includes microscale thermal and electrical property measurements using suspended microheater devices and atomic-scale phonon, electron, and SPhP probing with advanced 4D STEM-EELS techniques. These efforts aim to uncover strain-mediated transport mechanisms and provide precise control strategies for enhancing thermal, electrical, and optical performance in next-generation devices.
- Strain-thermal synergistic optimization design of 3D integrated chips
This includes developing models for cross-scale elastic strain-mediated thermal energy transport, focusing on the behavior of electrons and phonons under varying strain conditions. Key efforts are directed toward creating low temperature hybrid bonding techniques that achieve low interfacial thermal resistance, and minimal residual strain to improve bonding interface quality. Additionally, thermoreflectance-based non-invasive thermal and strain characterization methods will be developed to probe buried bonding interfaces with high precision, enabling a comprehensive understanding of strain-thermal coupling and its impact on the reliability and efficiency of 3D integrated architectures.
- Strain gradient engineering-inspired thermal functional materials and devices
We explore innovative strategies to harness the distinctive attributes of strain gradient engineering, including reversible functionality, on-demand tunability, bistable operation, and scalable fabrication. This approach enables the design of advanced thermal functionalities, including materials and devices with anisotropic heat conduction, Kirigami-inspired thermal switches for adaptable thermal regulation, and thermal rectifiers based on compositional gradient engineering to achieve asymmetric heat flow. These advancements aim to unlock new possibilities in thermal management systems, providing dynamic, energy-efficient solutions for next-generation electronic and energy devices.