Welcome to Functional Thermal Lab at College of Engineering, Peking University!

We are a research lab dedicated to the fundamental understanding of thermal energy carrier transport through micro/nanostructures and its application for a sustainable future. Our work combines theory and simulation with experiments to solve practical problems.

Our research focuses on the following topics：

• Characterization and regulation of elastic strain mediated phonon/electron/surface phonon polariton transport 
• Strain-thermal synergistic optimization design of 3D integrated chips
• Strain gradient engineering-inspired thermal functional materials and devices

We are actively recruiting Master, Ph.D. students and postdoctoral researchers with backgrounds in thermal physics, mechanics, materials science, or electron microscopy characterization. Undergraduate students and research assistants with relevant interests are also welcome to contact us (linyangpku@pku.edu.cn) for research opportunities.