- 2024
1. L. Zhao et al., “Broadband and High-Pressure Output PMUT Array Based on Lead-Free KNN Thin Film,” in 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS), Austin, January 21-25, 2024.
2. Y. Gao et al., “Ultra-Wide Range Frequency Tuning of Piezoelectric Micromachined Ultrasonic Transducers Via Dc Bias Voltage,” in 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS), Austin, January 21-25, 2024.
3. Y. Su et al., “A Curve-Structured Flexible PMUT With Enhanced Acoustic Sensitivity,” in 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS), Austin, January 21-25, 2024.
4. Y. Gao et al., "Characterization and Optimization of PZT-Based PMUTs With Wide Range Frequency Tuning," Journal of Microelectromechanical Systems, 2024.
5. L. Zhao et al., "Design, Fabrication, and Characterization of High-Performance PMUT Arrays Based on Potassium Sodium Niobate," Journal of Microelectromechanical Systems, 2024.
6. L. Zhao, J. Xia, C. Yang, and Y. Lu, "Modeling and experimental studies of mutual acoustic radiation effect on PMUT array," Sensors and Actuators A: Physical, vol. 377, p. 115677, 2024.
7. Z. You et.al., “Piezoelectric MEMS Microphones Based on Rib-Structures and Single Crystal PZT Thin Film,” Microsystems & Nanoengineering, 2024.
8. C. Yang et al. "A wafer-level characterization method of thin film transverse piezoelectric coefficient evaluation," Sensors and Actuators A: Physical, 2024.
- 2023
1. L. Zhao et al., “Piezoelectric Micromachined Ultrasonic Transducers for Consumer Electronics Applications,” in 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), Seoul, March 07-10, 2023.
- Selected Journal and Conference Publications Before 2022
1. Y. Lu, H. Tang, S. Fung, Q. Wang, J.M. Tsai, M. Daneman, B.E. Boser, and D.A. Horsley, " Ultrasonic Fingerprint Sensor Using a Piezoelectric Micromachined Ultrasonic Transducer Array Integrated with CMOS Electronics", Applied Physics Letters, 106, p. 263503, 2015 (Cover)
2. Y. Lu, H. Tang, S. Fung, B.E. Boser, and D.A. Horsley, "Pulse-Echo Ultrasound Imaging Using an AlN Piezoelectric Micromachined Ultrasonic Transducer Array with Transmit Beam-Forming", J. Microelectromechanical Systems, 99, pp. 1-9, 2016
3. Y. Lu, H. Tang, Q. Wang, S. Fung, J.M. Tsai, M. Daneman, B.E. Boser, and D.A. Horsley, "Waveguide piezoelectric micromachined ultrasonic transducer array for short-range pulse-echo imaging", Applied Physics Letters, 106, p. 193506, 2015
4. Y. Luand D.A. Horsley, "Modeling, Fabrication and Characterization of Piezoelectric Micromachined Ultrasonic Transducer Arrays Based on Cavity SOI Wafers", J. Microelectromechanical Systems, 24(4), pp. 1142-1149, 2015
5. Y. Lu, A. Heidari, and D.A. Horsley, "A High Fill-Factor Annular Array of High Frequency Piezoelectric Micromachined Ultrasonic Transducers", J. Microelectromechanical Systems, 24(4), pp. 904-913, 2015
6. X. Jiang, Y. Lu, H.Y. Tang, J.M. Tsai, E.J. Ng, M.J. Daneman, B.E. Boser, D.A. Horsley, “Monolithic Ultrasound Fingerprint Sensor”, Microsystems & Nanoengineering - Nature, Vol. 3, p. 17059, 2017
7. H.Y. Tang, Y. Lu, X. Jiang, E.J. Ng, J.M. Tsai, D.A. Horsley, B.E. Boser, “3-D Ultrasonic Fingerprint Sensor-on-a-Chip”, IEEE Journal of Solid-State Circuits, 51 (11), 2016
8. Y. Lu, X. Wu, W. Zhang, W. Chen, et al, “Research on Reference Vibration for Two-axis Piezoelectric Micro-Machined Gyroscope” Journal of Micromechanics and Microengineering, 20 (07), p. 5039, 2010
9. Q. Wang, Y. Lu, S. Mishin, Y. Oshmyansky, D.A. Horsley, Design, Fabrication, and Characterization of Scandium Aluminum Nitride-Based Piezoelectric Micromachined Ultrasonic Transducers, J. Microelectromechanical Systems, 26 (5), pp. 1132-1139, 2017
10. Y. Lu,X. Wu, W. Zhang, and W. Chen, “Optimization and Analysis of Novel Piezoelectric Solid Micro-Gyroscope with High Resistance to Shock” Microsystem technologies, 16, pp. 571–584, 2010
11. Y. Lu, H. Tang, S. Fung, B. E. Boser, and D. A. Horsley, "Short-Range and High-Resolution Ultrasound Imaging Using an 8 MHz Aluminum Nitride PMUT Array," IEEE MEMS, pp. 140-143, 2015. Best Paper Award Finalist
12. Y. Lu, O. Rozen, H. Tang, G.L. Smith, S. Fung, B.E. Boser, R.G. Polcawich, D.A. Horsley, "Broadband piezoelectric micromachined ultrasonic transducers based on dual resonance modes," IEEE MEMS, pp. 146-149, 2015
13. Y. Lu, A. Heidari, S. Shelton, A. Guedes and D.A. Horsley, "High frequency piezoelectric micromachined ultrasonic transducer array for intravascular ultrasound imaging," IEEE MEMS, pp. 745-748, 2014
14. Y. Lu, S. Shelton and D.A. Horsley, "High frequency and high fill factor piezoelectric micromachined ultrasonic transducers based on cavity SOI wafers", Solid-State Sensors, Actuators and Microsystems Workshop (Hilton Head), pp. 131-134, 2014
15. H. Tang, Y. Lu, F. Assaderaghi, M. Daneman, X. Jiang, M. Lim, X. Li, E. Ng, U. Singhal, J.M.Tsai, D.A. Horsley, B.E. Boser, “3-D Ultrasonic Fingerprint Sensor on a Chip”, ISSCC, pp. 202-203, 2016, Lewis Winner Award
16. H. Tang, Y. Lu, S. Fung, D.A. Horsley, B.E. Boser, "Integrated Ultrasonic System for Measuring Body-Fat Composition", ISSCC, pp. 1-3, 2015
17. X. Jiang, H. Tang, Y. Lu, X. Li, J.M.Tsai, E. Ng, M. Daneman, M. Lim, F. Assaderaghi, B.E. Boser, D.A. Horsley, “Monolithic 591×438 DPI Ultrasonic Fingerprint Sensor”, IEEE MEMS, pp. 107-110, 2016 Best Paper Award
18. Y. Lu, Q. Wang, and D.A. Horsley, “Piezoelectric Micromachined Ultrasonic Transducers with Increased Coupling Coefficient via Series Transduction”, IEEE International Ultrasonics Symposium (IUS), pp. 1-4, 2015
19. H. Tang, Y. Lu, S. Fung, J.M. Tsai, M. Daneman, D.A. Horsley, B.E. Boser, “Pulse-echo ultrasonic fingerprint sensor on a chip”, Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), pp. 674-677, 2015
20. X. Jiang, H. Tang, Y. Lu, E.J. Ng, J.M. Tsai, B.E. Boser, D.A. Horsley,“Ultrasonic Fingerprint Sensor With Transmit Beamforming Based on a PMUT Array Bonded to CMOS Circuitry”, IEEE Transactions on UFFC, 64(9), pp1401-1408, 2017
- Selected IP/Patents and Books Before 2022
1. Y. Lu, D.A. Horsley, H. Tang, and B.E. Boser, “MUT Fingerprint ID System”, 2014, US Patent 14/896,150.已转让并产业化(被业界领军公司竞买,被其他美国专利他引43次)。
2. Y. Lu, H.Y., Tang, H.V. Panchawagh, “Superpixel Array of Piezoelectric Ultrasonic Transducers for 2-D Beamforming”, 2016, US Patent US 14/883,586.
3. Y. Lu, D.W. Burns, “Biometric System with Photoacoustic Imaging”, 2017, US Patent 15/149, 048. 生物识别、人机交互传感
4. Y. Lu, D.W. Burns, “Biometric system with photoacoustic imaging”, 2017, US Patent 15/149,046. 医疗健康。
5. Y. Lu, J.L. Strohmann, H.V. Panchawagh, “Reducing background signal in imaging sensors”, 2019, US Patent 10,817,694.
6. Y. Lu, H.V. Panchawagh, K.D. Djordjev, J.H. Seo, N.I. Buchan, C.J. Tseng, T Kao, “Ultrasonic fingerprint sensor with flexible substrate”, 2020, US Patent 16/525,030.。
7. Y. Lu, H.V. Panchawagh, K.D. Djordjev, C.J. Tseng, N.I. Buchan, T. Kao, J.H. Seo, “Ultrasonic fingerprint sensor with electrically nonconductive acoustic layer”, 2019, US Patent App. 16/252,408.
8. Y. Liang, Y. Lu, H.V. Panchawagh, J.L. Strohmann, C. Xu, Temperature and ultrasonic sensor fusion for biometric sensing, 2020, US Patent 11/182,026.
9. Y. Kusano, Y. Lu, J.L. Strohmann, H.V. Panchawagh, Ultrasonic sensor array, 2019, US Patent 16/455,472.
10. Y. Lu, J.L. Strohmann, I Badge, H.V. Panchawagh, T. Kao, Apparatus and method for improved biometric sensing, 2019, US Patent 16/544,681.
11. H. Tang, Y. Lu, H.V. Panchawagh, Active beam-forming technique for piezoelectric ultrasonic transducer array, 2018, US Patent 14/883,585.
12. Y. Lu, H.V. Panchawagh, J.L. Strohmann, K.D. Djordjev, “Ultrasonic sensor array control to facilitate screen protectors”, 2020, US Patent 16/414,164.
13. J.L. Strohmann, Y. Lu, H.V. Panchawagh, “Broadband ultrasonic sensor”, 2020, US Patent 16/407,070.
14. J.L. Strohmann, Y. Lu, A. Hinger, D.W. Burns, Ultrasonic biometric system with harmonic detection, 2018, US Patent App. 15/804,902
15. D.A. Horsley, Y. Lu, O. Rozen, 书籍"Piezoelectric MEMS Resonators", 章节6,"Flexural Piezoelectric Resonators", 153-173, Springer International Publishing,2017.