<?xml version="1.0" encoding="UTF-8"?><xml><records><record><source-app name="Biblio" version="7.x">Drupal-Biblio</source-app><ref-type>17</ref-type><contributors><authors><author><style face="normal" font="default" size="100%">Feng, Tianli</style></author><author><style face="normal" font="default" size="100%">Zhou, Hao</style></author><author><style face="normal" font="default" size="100%">Cheng, Zhe</style></author><author><style face="normal" font="default" size="100%">Larkin, Leighann</style></author><author><style face="normal" font="default" size="100%">Neupane, Mahesh</style></author></authors></contributors><titles><title><style face="normal" font="default" size="100%">A Critical Review of Thermal Transport across Wide and Ultrawide Bandgap Semiconductor Interfaces</style></title><secondary-title><style face="normal" font="default" size="100%">ACS Applied Materials &amp;amp;amp; Interfaces</style></secondary-title></titles><dates><year><style  face="normal" font="default" size="100%">2023</style></year></dates><urls><web-urls><url><style face="normal" font="default" size="100%">https://pubs.acs.org/doi/abs/10.1021/acsami.3c02507</style></url></web-urls></urls><volume><style face="normal" font="default" size="100%">15</style></volume><pages><style face="normal" font="default" size="100%">29655–29673</style></pages><language><style face="normal" font="default" size="100%">eng</style></language><issue><style face="normal" font="default" size="100%">25</style></issue></record></records></xml>