<?xml version="1.0" encoding="UTF-8"?><xml><records><record><source-app name="Biblio" version="7.x">Drupal-Biblio</source-app><ref-type>17</ref-type><contributors><authors><author><style face="normal" font="default" size="100%">Mu*, Fengwen</style></author><author><style face="normal" font="default" size="100%">Cheng*, Zhe</style></author><author><style face="normal" font="default" size="100%">Shi, Jingjing</style></author><author><style face="normal" font="default" size="100%">Shin, Seongbin</style></author><author><style face="normal" font="default" size="100%">Xu, Bin</style></author><author><style face="normal" font="default" size="100%">Shiomi, Junichiro</style></author><author><style face="normal" font="default" size="100%">Graham, Samuel</style></author><author><style face="normal" font="default" size="100%">Suga, Tadatomo</style></author></authors></contributors><titles><title><style face="normal" font="default" size="100%">High Thermal Boundary Conductance across Bonded Heterogeneous GaN-SiC Interfaces</style></title><secondary-title><style face="normal" font="default" size="100%">ACS Applied Materials &amp;amp; Interfaces</style></secondary-title></titles><dates><year><style  face="normal" font="default" size="100%">2019</style></year></dates><publisher><style face="normal" font="default" size="100%">ACS</style></publisher><volume><style face="normal" font="default" size="100%">11</style></volume><pages><style face="normal" font="default" size="100%">33428–33434</style></pages><language><style face="normal" font="default" size="100%">eng</style></language><issue><style face="normal" font="default" size="100%">36</style></issue></record></records></xml>