<?xml version="1.0" encoding="UTF-8"?><xml><records><record><source-app name="Biblio" version="7.x">Drupal-Biblio</source-app><ref-type>10</ref-type><contributors><authors><author><style face="normal" font="default" size="100%">Yates, Luke</style></author><author><style face="normal" font="default" size="100%">Cheaito, Ramez</style></author><author><style face="normal" font="default" size="100%">Sood, Aditya</style></author><author><style face="normal" font="default" size="100%">Cheng, Zhe</style></author><author><style face="normal" font="default" size="100%">Bougher, Thomas</style></author><author><style face="normal" font="default" size="100%">Asheghi, Mehdi</style></author><author><style face="normal" font="default" size="100%">Goodson, Kenneth</style></author><author><style face="normal" font="default" size="100%">Goorsky, Mark</style></author><author><style face="normal" font="default" size="100%">Faili, Firooz</style></author><author><style face="normal" font="default" size="100%">Twitchen, Dan</style></author></authors></contributors><titles><title><style face="normal" font="default" size="100%">Investigation of the heterogeneous thermal conductivity in bulk CVD diamond for use in electronics thermal management</style></title><secondary-title><style face="normal" font="default" size="100%">International Electronic Packaging Technical Conference and Exhibition</style></secondary-title></titles><dates><year><style  face="normal" font="default" size="100%">2017</style></year></dates><publisher><style face="normal" font="default" size="100%">American Society of Mechanical Engineers</style></publisher><volume><style face="normal" font="default" size="100%">58097</style></volume><pages><style face="normal" font="default" size="100%">V001T04A014</style></pages><isbn><style face="normal" font="default" size="100%">079185809X</style></isbn><language><style face="normal" font="default" size="100%">eng</style></language></record></records></xml>