@conference {40343,
	title = {Thermal Conductivity Mapping of Interconnects and Active Layers of Logic Chips},
	booktitle = {EDTM},
	year = {2026},
	publisher = {IEEE},
	organization = {IEEE},
	author = {Yiyun He and Huang, Zifeng and Ming Li and Runsheng WANG and Cheng, Zhe}
}
