@proceedings {37515,
	title = {AIG-CIM: A Scalable Chiplet Module with Tri-Gear Heterogeneous Compute-in-Memory for Diffusion Acceleration},
	journal = {ACM/IEEE Design Automation Conference (DAC)},
	year = {2024},
	url = {https://dl.acm.org/doi/10.1145/3649329.3657373},
	author = {Yiqi Jing and Wu, Meng and Jiaqi Zhou and Yiyang Sun and Yufei Ma and Ru HUANG and Le Ye* and Tianyu Jia*}
}
