<?xml version="1.0" encoding="UTF-8"?><xml><records><record><source-app name="Biblio" version="7.x">Drupal-Biblio</source-app><ref-type>17</ref-type><contributors><authors><author><style face="normal" font="default" size="100%">Dong Wang</style></author><author><style face="normal" font="default" size="100%">Sihong Shao</style></author><author><style face="normal" font="default" size="100%">Changhao Yan</style></author><author><style face="normal" font="default" size="100%">Wei Cai</style></author><author><style face="normal" font="default" size="100%">Xuan Zeng</style></author></authors></contributors><titles><title><style face="normal" font="default" size="100%">       Feature-scale simulations of particulate slurry flows in chemical mechanical polishing by smoothed particle hydrodynamics</style></title><secondary-title><style face="normal" font="default" size="100%">Communications in Computational Physics</style></secondary-title></titles><dates><year><style  face="normal" font="default" size="100%">2014</style></year></dates><urls><web-urls><url><style face="normal" font="default" size="100%">https://doi.org/10.4208/cicp.261213.030614a</style></url></web-urls></urls><volume><style face="normal" font="default" size="100%">16</style></volume><pages><style face="normal" font="default" size="100%">1389-1418</style></pages><language><style face="normal" font="default" size="100%">eng</style></language><abstract><style face="normal" font="default" size="100%">In this paper, the mechanisms of material removal in chemical&amp;nbsp;mechanical polishing (CMP) processes are investigated in detail by the&amp;nbsp;smoothed particle hydrodynamics (SPH) method. The feature-scale&amp;nbsp;behaviours of slurry flow, rough pad, wafer defects, moving solid&amp;nbsp;boundaries, slurry-abrasive interactions, and abrasive collisions are&amp;nbsp;modelled and simulated. Compared with previous work on CMP&amp;nbsp;simulations, our simulations incorporate more realistic physical&amp;nbsp;aspects of the CMP process, especially the effect of abrasive&amp;nbsp;concentration in the slurry flows. The preliminary results on slurry&amp;nbsp;flow in CMP provide microscopic insights on the experimental data of&amp;nbsp;the relation between the removal rate and abrasive concentration and&amp;nbsp;demonstrate that SPH is a suitable method for the research of CMP&amp;nbsp;processes.</style></abstract><issue><style face="normal" font="default" size="100%">5</style></issue></record></records></xml>