@article {26656,
	title = {       Feature-scale simulations of particulate slurry flows in chemical mechanical polishing by smoothed particle hydrodynamics},
	journal = {Communications in Computational Physics},
	volume = {16},
	year = {2014},
	pages = {1389-1418},
	abstract = {In this paper, the mechanisms of material removal in chemical\&nbsp;mechanical polishing (CMP) processes are investigated in detail by the\&nbsp;smoothed particle hydrodynamics (SPH) method. The feature-scale\&nbsp;behaviours of slurry flow, rough pad, wafer defects, moving solid\&nbsp;boundaries, slurry-abrasive interactions, and abrasive collisions are\&nbsp;modelled and simulated. Compared with previous work on CMP\&nbsp;simulations, our simulations incorporate more realistic physical\&nbsp;aspects of the CMP process, especially the effect of abrasive\&nbsp;concentration in the slurry flows. The preliminary results on slurry\&nbsp;flow in CMP provide microscopic insights on the experimental data of\&nbsp;the relation between the removal rate and abrasive concentration and\&nbsp;demonstrate that SPH is a suitable method for the research of CMP\&nbsp;processes.},
	url = {https://doi.org/10.4208/cicp.261213.030614a},
	author = {Dong Wang and Sihong Shao and Changhao Yan and Wei Cai and Xuan Zeng}
}
