<?xml version="1.0" encoding="UTF-8"?><xml><records><record><source-app name="Biblio" version="7.x">Drupal-Biblio</source-app><ref-type>17</ref-type><contributors><authors><author><style face="normal" font="default" size="100%">Gao, Jingnan</style></author><author><style face="normal" font="default" size="100%">Jin, Yufeng</style></author><author><style face="normal" font="default" size="100%">Xie, Bing</style></author><author><style face="normal" font="default" size="100%">Wen, C.P.</style></author><author><style face="normal" font="default" size="100%">Hao, Yilong</style></author><author><style face="normal" font="default" size="100%">Shen, Bo</style></author><author><style face="normal" font="default" size="100%">Wang, Maojun</style></author></authors></contributors><titles><title><style face="normal" font="default" size="100%">Low ON-Resistance GaN Schottky Barrier Diode With High VON Uniformity Using LPCVD Si3N4 Compatible Self-Terminated, Low Damage Anode Recess Technology</style></title><secondary-title><style face="normal" font="default" size="100%">IEEE Electron Device Letters</style></secondary-title></titles><dates><year><style  face="normal" font="default" size="100%">2018</style></year><pub-dates><date><style  face="normal" font="default" size="100%">June</style></date></pub-dates></dates><publisher><style face="normal" font="default" size="100%">IEEE</style></publisher><pub-location><style face="normal" font="default" size="100%">USA</style></pub-location><volume><style face="normal" font="default" size="100%">39</style></volume><pages><style face="normal" font="default" size="100%">859-62</style></pages><language><style face="normal" font="default" size="100%">eng</style></language><abstract><style face="normal" font="default" size="100%">In this letter, we demonstrate a recessed-anode Schottky barrier diode (SBD) on a double AlGaN/GaN heterojunction structure. A self-terminated, oxidation/wet etching with low-pressure chemical vapor deposition (LPCVD) Si3N4 mask is applied in the anode recess process. Unlike common plasma-based, dry etching techniques, the etched surface is not subjected to ion bombardment, and the etch depth is precisely controlled. As a result, a high effective channel mobility of 1079 cm2/V . s is maintained in the channel beneath the recess surface. The fabricated devices with a 15-mum anode-to-cathode distance (LAC) are found to exhibit a uniform, low turn-ON voltage (VON) of 0.69 +or- 0.03 V, and a low specific on-resistance (RON,SP) of 2.83 mQ . cm2. The SBDs also show excellent off-state blocking characteristics due to the smooth recess interface together with the assistance of LPCVD grown Si3N4. A breakdown voltage of 1190 V is achieved for the SBDs with 15-mum LAC at a leakage current criteria of 1 muA/mm, and the Baliga's figure-of-merit is 500 MW/cm2.</style></abstract><work-type><style face="normal" font="default" size="100%">Journal Paper</style></work-type></record></records></xml>