<?xml version="1.0" encoding="UTF-8"?><xml><records><record><source-app name="Biblio" version="7.x">Drupal-Biblio</source-app><ref-type>17</ref-type><contributors><authors><author><style face="normal" font="default" size="100%">Meng, Di</style></author><author><style face="normal" font="default" size="100%">Lin, Shuxun</style></author><author><style face="normal" font="default" size="100%">Wen, Cheng P.</style></author><author><style face="normal" font="default" size="100%">Wang, Maojun</style></author><author><style face="normal" font="default" size="100%">Wang, Jinyan</style></author><author><style face="normal" font="default" size="100%">Hao, Yilong</style></author><author><style face="normal" font="default" size="100%">Zhang, Yaohui</style></author><author><style face="normal" font="default" size="100%">Lau, Kei May</style></author><author><style face="normal" font="default" size="100%">Wu, Wengang</style></author></authors></contributors><titles><title><style face="normal" font="default" size="100%">Low Leakage Current and High-Cutoff Frequency AlGaN/GaN MOSHEMT Using Submicrometer-Footprint Thermal Oxidized TiO2/NiO as Gate Dielectric</style></title><secondary-title><style face="normal" font="default" size="100%">IEEE ELECTRON DEVICE LETTERS</style></secondary-title></titles><dates><year><style  face="normal" font="default" size="100%">2013</style></year><pub-dates><date><style  face="normal" font="default" size="100%">JUN</style></date></pub-dates></dates><number><style face="normal" font="default" size="100%">6</style></number><volume><style face="normal" font="default" size="100%">34</style></volume><pages><style face="normal" font="default" size="100%">738-740</style></pages><language><style face="normal" font="default" size="100%">eng</style></language><abstract><style face="normal" font="default" size="100%">AlGaN/GaN metal oxide semiconductor high electron mobility transistors (MOSHEMTs) with thick (&gt;35 nm), high-kappa (TiO2/NiO), submicrometer-footprint (0.4 mu m) gate dielectric are found to exhibit two orders of magnitude in lower gate leakage current (similar to 1 nA/mm up to +3-V applied gate bias), higher I-MAX (709 mA/mm), and higher drain breakdown voltage, compared to Schottky barrier (SB) HEMTs of the same geometry. The maximum extrinsic transconductance of both the MOSHEMTs and the SBHEMTs with 2 x 80-mu m gate fingers is measured to be 149 mS/mm. The addition of the submicrometer-footprint gate oxide layer only results in a small reduction of the current gain cutoff frequency (21 versus 25 GHz, derived from S-parameter test data) because of the high permittivity (kappa approximate to 100) of the gate dielectric. This high-performance submicrometer-footprint MOSHEMT is highly promising for microwave power amplifier applications in communication and radar systems.</style></abstract><custom7><style face="normal" font="default" size="100%">000319460800007</style></custom7></record></records></xml>