<?xml version="1.0" encoding="UTF-8"?><xml><records><record><source-app name="Biblio" version="7.x">Drupal-Biblio</source-app><ref-type>17</ref-type><contributors><authors><author><style face="normal" font="default" size="100%">Lin, Shuxun</style></author><author><style face="normal" font="default" size="100%">Wang, Maojun</style></author><author><style face="normal" font="default" size="100%">Xie, Bing</style></author><author><style face="normal" font="default" size="100%">Wen, Cheng P.</style></author><author><style face="normal" font="default" size="100%">Min Yu</style></author><author><style face="normal" font="default" size="100%">Wang, Jinyan</style></author><author><style face="normal" font="default" size="100%">Hao, Yilong</style></author><author><style face="normal" font="default" size="100%">Wu, Wengang</style></author><author><style face="normal" font="default" size="100%">Huang, Sen</style></author><author><style face="normal" font="default" size="100%">Chen, Kevin J.</style></author><author><style face="normal" font="default" size="100%">Shen, Bo</style></author></authors></contributors><titles><title><style face="normal" font="default" size="100%">Reduction of Current Collapse in GaN High-Electron Mobility Transistors Using a Repeated Ozone Oxidation and Wet Surface Treatment</style></title><secondary-title><style face="normal" font="default" size="100%">IEEE ELECTRON DEVICE LETTERS</style></secondary-title></titles><dates><year><style  face="normal" font="default" size="100%">2015</style></year><pub-dates><date><style  face="normal" font="default" size="100%">AUG</style></date></pub-dates></dates><number><style face="normal" font="default" size="100%">8</style></number><volume><style face="normal" font="default" size="100%">36</style></volume><pages><style face="normal" font="default" size="100%">757-759</style></pages><language><style face="normal" font="default" size="100%">eng</style></language><abstract><style face="normal" font="default" size="100%">This letter reports a GaN high-electron mobility transistor (HEMT) with reduced current collapse using a multicycle combined plasma-free ozone oxidation and wet surface treatment before Si3N4 passivation. The surface oxide and decomposed layers could be effectively removed and a perfect AlGaN surface is obtained after the treatment. Pulsed IV and RF power measurement indicate that the current collapse is greatly suppressed due to the removal of imperfect surface layer and damage free nature, providing an effective surface treatment method to improve the effect of passivation in GaN HEMT.</style></abstract><custom7><style face="normal" font="default" size="100%">000358570300007</style></custom7></record></records></xml>