<?xml version="1.0" encoding="UTF-8"?><xml><records><record><source-app name="Biblio" version="7.x">Drupal-Biblio</source-app><ref-type>17</ref-type><contributors><authors><author><style face="normal" font="default" size="100%">Lin, Shuxun</style></author><author><style face="normal" font="default" size="100%">Wang, Maojun</style></author><author><style face="normal" font="default" size="100%">Sang, Fei</style></author><author><style face="normal" font="default" size="100%">Ming Tao</style></author><author><style face="normal" font="default" size="100%">Wen, Cheng P.</style></author><author><style face="normal" font="default" size="100%">Xie, Bing</style></author><author><style face="normal" font="default" size="100%">Min Yu</style></author><author><style face="normal" font="default" size="100%">Wang, Jinyan</style></author><author><style face="normal" font="default" size="100%">Hao, Yilong</style></author><author><style face="normal" font="default" size="100%">Wu, Wengang</style></author><author><style face="normal" font="default" size="100%">Jun Xu</style></author><author><style face="normal" font="default" size="100%">Cheng, Kai</style></author><author><style face="normal" font="default" size="100%">Shen, Bo</style></author></authors></contributors><titles><title><style face="normal" font="default" size="100%">A GaN HEMT Structure Allowing Self-Terminated, Plasma-Free Etching for High-Uniformity, High-Mobility Enhancement-Mode Devices</style></title><secondary-title><style face="normal" font="default" size="100%">IEEE ELECTRON DEVICE LETTERS</style></secondary-title></titles><dates><year><style  face="normal" font="default" size="100%">2016</style></year><pub-dates><date><style  face="normal" font="default" size="100%">APR</style></date></pub-dates></dates><number><style face="normal" font="default" size="100%">4</style></number><volume><style face="normal" font="default" size="100%">37</style></volume><pages><style face="normal" font="default" size="100%">377-380</style></pages><language><style face="normal" font="default" size="100%">eng</style></language><abstract><style face="normal" font="default" size="100%">In this letter, a plasma-free etch stop structure is developed for GaN HEMT toward enhancement-mode operation. The self-terminated precision gate recess is realized by inserting a thin AlN/GaN bilayer in the AlGaN barrier layer. The gate recess is stopped automatically at the GaN insertion layer after high-temperature oxidation and wet etch, leaving a thin AlGaN barrier to maintain a quantum well channel that is normally pinched off. With addition of an Al2O3 gate dielectric, quasi normally OFF GaN MOSHEMTs have been fabricated with high threshold uniformity and low ON-resistance comparable with the normally ON devices on the same wafer. A high channel mobility of 1400 cm(2)/V . s was obtained due to the preservation of the high electron mobility in the quantum-well channel under the gate.</style></abstract><custom7><style face="normal" font="default" size="100%">000373129300006</style></custom7></record></records></xml>